Smart Integrated Sensors Solutions

  SensIQ is a Phoenix, Arizona based company developing integrated sensor solutions enabling active AI on the Edge, with diverse applications in consumer, industrial, wearables, robotics, medical, and automotive markets. 

  SensIQ is led by an experienced team with over 200 years of experience with a proven record in innovation, design, development, and manufacturing of semiconductor products.  

  SensIQ has a patent-protected technology called MIMS (Monolithically Integrated Multi-Sensors) to integrate multiple diverse physical sensors on the same silicon substrate. 

  The MIMS technology provides the benefits of small size, low power consumption, lower cost, increased functionality, and better reliability. 

  The MIMS technology establishes a standard platform for the design and manufacturing of a wide variety of sensors, thus reducing the cycle time for new product design and introduction.

  The MIMS platform using inputs from multiple data streams of distributed sensors nodes is combined with AI processors in a system level integration scheme to enable real-time action driven intelligence solutions, with unparalleled improvements in efficiency, productivity, performance, and security. 

  The served global Internet of Things (IoT) market is projected to reach $4,062 billion by 2032 with a compound annual growth rate (CAGR) of 24.3% from 2024 to 2032.  

  The MIMS platform enables the co-design and co-fabrication of multiple, diverse sensors using a CMOS compatible process that uses standard materials, processes and equipment. 

  The MIMS technology uses a single fabrication process, a single ASIC (Application Specific Integrated Circuit), and a single assembly process in a single package. 

  This technology has already been proven with five sensors in a 3mm X 3mm chip.

  The MIMS platform advances the integration roadmap from discrete packaged sensors integrated in a PCB (Printed Circuit Board) to multiple, different sensors integrated on the same chip using a common fabrication process in the front-end and a common assembly process in the back-end. 

  This sensor integration evolution results in increased functionality, performance, reliability and density with reduced cost and power consumption. 

  The MIMS platform enables the monolithic integration of multiple diverse sensors using standard MEMS process modules. The platform allows the design and fabrication of sensors that may be sealed from the environment at various levels of pressure and vacuum or be open to the ambient. 

  The monolithic integration is suitable to the development of a library of sensors that may be designed and fabricated with a common fabrication process flow using a PDK.

  Combined with a high level of system integration, the MIMS platform enables the design of wearables with unique form factors. 

  Wearables in the form of a wrist band, pendant, chest strip, patch and sticker can be manufactured to provide multiple choices to the users.

  The MIMS platform allows the design of sensors and solutions that are very suitable for robotics and automation. 

  Many robotic applications need multiple, diverse sensors that respond to different input parameters while maintaining high sensitivity in a small, flexible form factor. 

  The small size and additional functionality of MIMS sensors are uniquely suited to support automation needed in factories, homes, buildings and equipment.

  The MIMS platform is very suitable for applications that are sensitive to weight, size, power consumption, performance and reliability. This is particularly true for drones that use inertial sensors such as accelerometers, gyroscopes, and magnetic sensors, and functional payloads. 

  Payloads may include sensors for environmental or situational monitoring. Furthermore, cost effective sensor redundancy and resiliency can be enabled with our MIMS technology.